Accelerating Semiconductor Research,
Accelerating America

The American Semiconductor Innovation Coalition (ASIC) represents 200 businesses, startups, universities, national labs, and nonprofits dedicated to bringing the best research and development to The National Semiconductor Technology Center and The National Advanced Packaging Manufacturing Program.

Global Chip Shortage

Semiconductors are part of the backbone of modern life. The ongoing shortage is disrupting supply chains, impacting consumers and businesses, and threatening national security. It exposes the lack of sustained domestic investment in the semiconductor industry and highlights the need for the U.S. to reinvest to guarantee a steady supply of chips and world leadership in chip research and development.  

 

The Vision for
The NSTC and NAPMP

 

To protect U.S. semiconductor leadership, manufacturing continually fueled by world-leading research and development is key. 

The 2021 National Defense Authorization Act’s (NDAA) call to create a National Semiconductor Technology Center (NSTC) and a National Advanced Packaging Manufacturing Program (NAPMP) establishes a pathway for this urgent investment. It will uniquely accelerate the U.S. transformation into a secure semiconductor powerhouse.


ASIC – a broad coalition of businesses, universities, national labs, and nonprofits – has put forward a vision of a technology network, with hubs and geographically distributed centers of excellence, as the main technical driver of the National Semiconductor Technology Center (NSTC) and the National Advanced Packaging Manufacturing Program (NAPMP), supporting the research, development, prototyping, and manufacturing transfer goals of the NSTC and NAPMP and ensuring they are met. 

To reach that objective, the technology network must achieve the following:

INNOVATION ECOSYSTEM

Provide an innovation ecosystem for research, development, and prototyping with first-class resources, scientists, facilities, and partners who can work quickly and efficiently.

TECHNICAL AGENDA

Create and execute on an ambitious, but practical, technical agenda focused on the transition from innovation to commercialization.

EXPERIENCED WORKFORCE

Include teams experienced in taking discovery from “lab-to-fab.”

EXPANDED PRIOR INVESTMENT

Expand existing large piloting and prototype integration centers to leverage prior investment and hit the ground running on day one. 

IMPROVED INFRASTRUCTURE

Upgrade the infrastructure and programs at key universities, reducing the time for tech transfer and facilitating workforce investment.

START-UP SUPPORT  

Facilitate start-ups with access to prototyping facilities provided by the network.

Response to Department of Commerce Request for Information

The American Semiconductor Innovation Coalition (ASIC) with broad representation of industries, small companies, universities, colleges, consortia, and nonprofits, and with technical advice from national labs, offers responses to the Department of Commerce Request for Information 2022-01305. The key principles in the response outline critical aspects to bolster a robust domestic semiconductor supply chain that is achievable, scalable, and sustainable.

Coalition Members Include

Materion
  • Accenture

    Advanced Silicon Group

    Advantest

    Advent Diamond, Inc.

    Ajuba

    Akoustis, Inc.

    Alphawave

    Ambature, Inc.

    AMD

    Analog Devices

    Analog Photonics

    Anari AI

    ANSYS

    Applied Materials

    Argonne National Laboratory

    Arizona State University

    ASE Group

    ASM

    ASML

    ASMPT

    ASPDL

    AT&S

    Atomera

    Atomica

    Auburn University

    Austin Community College

    BAE Systems

    Battelle Memorial

    Blue Cheetah

    Boston University

    Brewer Science Inc.

    BroadPak

    BrYet US

    Cadence

    Cal Poly

    Calumet Electronics

    Canon Nanotechnologies

    Carnegie Mellon University

    Caspia

    CEA-Leti

    Cerfe Labs

    City University of New York

    Clarkson University

    CMC Microsystems

    Coherent

    Collin’s Aerospace (Raytheon Technologies)

    Columbia University

    Cornell University

    Deca Technologies

    DPS

    Drexel University

    Duke University

    DuPont

    Edwards Vacuum

    eFabless

    EMD Digital

    Entegris

    Evatec AG

    Exyte

    Fermi National Lab

    Finwave Semiconductor

    FormFactor

    Fraunhofer

    Free Form Fibers

    Frontier Design Automation

    GE Research

    Georgia Institute of Technology

    Global Foundries

    Google

    GreenSource Fab

    Groq, Incl

    Hyperion

    IBM

    Icahn School of Medicine at Mt. Sinai

    imec

    Impact Nano

    Indium Corp.

    iNEMI

    Integra Tech

    International Microelectronics Assembly and Packaging Society

    Intrinsic

    IPC

    Jabil, Inc.

    JSR Micro

    Kinetics

    KLA Corporation

    KPN Technology

    Kyocera SLD Laser

    Lam Research

    Last Mile Education Fund

    Linde

    Lux Semiconductor

    Marvell

    Massachusetts Institute of Technology

    Materion

    Medtronic

    Menlo Microsystems

    Mercury Systems, Inc.

    Metis MicroSystems

    Micron Technology

    Microsoft

    Mosaic Microsystems

    Murata Manufacturing Co, Ltd.

    Mythic

    NanoDX

    Nantero

    NASA.us LLC

    National Institute for Innovation and Technology

    NeoLogic

    Nepes

    NeuReality

    New York City Economic Development Corporation

    New York State Economic Development Council

    New York University

    NextFlex

    Nhanced Semiconductor

    Northrop Grumman

    Notre Dame

    NOVA

    Novarion Systems

    North Carolina Agricultural and Technical State University

    Nubis Communications

    Nvidia

    NY CREATES

    Ohio State University

    Omni Design Tech

    Palo Alto Electron

    PARC

    Partnership For Rhode Island

    Pasadena Area Community College

    PDF Solutions

    Pennsylvania State University

    Phase Sensitive Innovations

    Phlotonics

    Photoronics, Inc.

    Polar Semiconductor

    Portland State University

    Precision Innovations

    Princeton Plasma Physics Lab

    Princeton University

    Promex, Inc.

    Purdue University

    Qorvo, Inc.

    Qualcomm

    Rensselaer Polytechnic institute (RPI)

    Rochester Institute of Technology (RIT)

    Rutgers

    Samsung

    Sandbox Semiconductor

    San Jose State University

    Sara Micro Devices

    SCREEN Semiconductor Solutions Co., Ltd

    Seagate Tech

    SEMI

    Semiconductor Industry Association

    Showa Denko

    Siemens-EDA

    SiFive, Inc.

    Silicon Box

    Silicon Catalyst

    SiPhox Inc

    SkyWater Technology

    Spark Photonics Design

    Spark Photonics Foundation

    SRC

    State University of New York

    Steel Perlot

    Stevens Institute of Technology

    SunRay

    Synopsys Inc.

    Syracuse University

    TechSearch International

    TechCet

    TEL

    Teledyne

    Terecircuits

    TetraMem

    Texas A&M

    Texas Instruments

    Thermo Fisher

    Toppan Photomask

    TOK

    Travera

    TTM Technologies, Inc.

    ULVAC

    Universal Instruments

    University of Arizona

    University of California, Davis

    University of California, Irvine

    University of California, Los Angeles

    University of California, San Diego

    University of Chicago

    University of Dayton School of Engineering

    University of Florida

    University of Illinois at Urbana-Champaign

    University of Maryland

    University of Massachusetts Amherst

    University of Michigan

    University of Minnesota

    University of Oregon

    University of Puerto Rico

    University of Rochester

    University of Southern California, Viterbi Information Sciences Institute

    University of Tennessee, Knoxville

    University of Texas

    University of Vermont

    University of Virginia

    University of Wisconsin

    Veeco

    Ventana Micro Systems

    WattsButler LLC

    Western Digital

    Worcester Polytechnic Institute

    Xallent, Inc.

    Yield Engineering Systems

    Yale University

    Yole Development

    Zero ASIC

    Zestron High Precision Cleaning

    3D Glass Solutions